Cold plasma setrilization device

ABSTRACT

A cold plasma device for large area decontamination that can function as a scrub brush to sterilize surfaces and areas that are otherwise difficult, time consuming and/or may cause exposure hazards under convention sterilization methods.

PRIORITY

The present application is a continuation application of U.S.application Ser. No. 12/012,446, filed Feb. 2, 2008, the contents ofwhich are hereby incorporated by reference.

FIELD OF THE INVENTION

A large-area cold plasma decontamination device for decontamination ofnuclear, biological, medical and chemical incidents in military,industrial and civilian situations.

BACKGROUND

Atmospheric discharge cold plasma technology has been employed by themedical community for several years. Examples of high power uses includetissue ablation, suture sealing and sterilization of a tissue area. Lowpower uses may include dermatologic, hemostasis and other health-fieldrelated applications.

The term “cold plasma” is used to indicate that only a small fraction ofthe inert carrier gas is ionized, although this fraction can be adjustedto suit the particular use or application. Typically, the ionizedportion of the carrier gas can range between approximately 10⁻⁶ (a veryweak plasma beam) to approximately 10⁻³ (a strong beam). A plasma can beformed where a gas is exposed to a specific amount of energy, and thatenergy exposure separates the gas component molecules into a collectionof ions, electrons, charge-neutral gas molecules, and other species invarying degrees of excitation. Effectiveness has been demonstrated inrapid sterilization, decontamination and industrial processing. Unlikesemiconductor industry applications, the cold plasma technology does notrequire a vacuum chamber. The plasma discharge is conducted in the openair.

The mean electron energy (or temperature) of a cold plasma isconsiderably higher than that of the bulk-gas molecules. Energy isprimarily added to the electrons rather than the ions and background gasmolecules, and the electrons can attain energies of approximately 10⁻¹eV or higher, while background gas remains at ambient temperature. Asignificant energy savings can be realized since electrons arepreferentially excited and larger ions are left in a lower energy statein a cold plasma.

A plasma may also be formed when a modulated electric field is appliedto a pair of electrodes and exposed to the gas. The plasma formation cancause oxygen molecules of the air passing near the electrodes to breakdown into component molecules, including reactive oxygen species(“ROS”). Organic substrates, such as bacteria, viruses, microbes andmold spores can be exposed to ROS, and then destroyed or renderedharmless rapidly. The same reaction can convert much or all of the ROSback into oxygen.

Cold plasmas can provide rapid decontamination of clothing, equipment orgear, and sterilization of medical equipment or food. However, whilepresent methods of decontamination and sterilization may require longperiods of time, even hours or days and generate damaging heat in theprocess; a cold plasma of the present disclosure can often sanitize anarea or object very briefly, in seconds or minutes.

It would be advantageous in a number a fields to provide a cold plasmathat can decontaminate or sterile large areas rapidly.

SUMMARY OF THE INVENTION

This disclosure relates to a decontamination Device having, at least, agas source, where the gas is typically an inert gas, a gas manifold, atleast one resistor network, which may be formed of various types ofresistors, and a power source. The Device forms a plasma that may beemployed to decontaminate large areas rapidly and efficiently in avariety applications.

FIGURES

FIG. 1 is a cross-sectional view of the general formation of the bulkdistributed resistor.

DETAILED DISCLOSURE

The disclosed atmospheric discharge cold plasma device (the “Device”) isa large-area mechanism to provide decontamination, sterilization andgeneral “clean-up” with, inter alia, nuclear fallout or waste,biologicals, chemicals, and industrial waste. The Device may be employedin any setting, including in urban outdoor areas, in medical facilities,military facilities, airplane hangers, storage facilities, inside tanksand other holding facilities, and the like. The Device may be operatedremotely, preset for operation, or manually operated. It may also bedisposable or reusable. The Device provides great advantages over thecold plasma prior art, which is generally directed to medical uses,because very large areas may be decontaminated or sterilized rapidly,and no prior preparation of the area is required in any way.Electrosurgical uses of plasma are disclosed in, inter alia, U.S.Application 2004/0116918, which is incorporated herein in its entirety.

The Device's plasma beam is emitted via the applicator portion of theDevice and can have multiple modes of action to achieve the desiredeffect. These modes include ion bombardment, electron bombardment,thermal effects, ultra-violet emissions, and the local generation ofozone. Via any of these modes, and combinations thereof, the flowinginert carrier gas can help carry away debris, and expose a clean, freshsurface. The ratio of electrical energy input to carrier gas flow ratecan be adjusted over a wide range, to allow the overall effect to bevaried over a wide range.

The device has a scalable approach to producing a large area plasmaapplicator, which can range from approximately one millimeter diameterpin-point beam to a much larger area beam array, which may beapproximately a square meter area or more. A large plasma beam area canbe employed as a plasma scrub brush for use in a variety of situationsfor decontamination and/or sterilization. Devices can be built in amanner that allows flexibility and can adjust to contoured surfaces.Such flexibility may be employed in an even wider number ofcircumstances including holding tanks, reactors, and the like.

One of the primary benefits of the Device, and atmospheric dischargecold plasma technology, is the combined impact of multiple modes ofaction that provide an antimicrobial action against a wide spectrum oforganisms and spores, including bacteria, viruses, microbes, fungi, andthe like. This same effect would allow for decontamination of a widespectrum of biological agents typically deployed in biological weaponsof mass destruction, and yet cause little or no collateral damage to thesubstrate during decontamination. The Device can be formed to permitsafe and relatively rapid decontamination of large affected areas ascompared to more typical or traditional clean-up methods. In addition,the Device does not use hazardous chemicals or generate hazardous wastestreams, unlike previously known devices and clean-up methods.

The Device may also be employed against chemicals using the same modesof plasma action by breaking down chemical bonds of chemical weaponsagents, by reducing chemicals to simple compounds such as water, carbondioxide, and the like. The Device as a plasma scrub bush would beparticularly effective to decontaminate porous substrates and surfaceswhich are highly problematic in such situations. The Device candecontaminate the porous surfaces of these substrates because theindividual plasma beams can travel to the substrate surface despiteuneven surface levels. Again, the Device has little or no deleteriouseffect(s) on the substrate itself.

The Device may also be used to remove, isolate or destroy radioisotopecompounds, particularly those associated with weapons. Currently, notechnology exists in the prior art to reduce the specific activity ofradioisotopes, which can be deployed in a weapon, or so called “dirtybomb”. The goal of removing and isolating radioisotopes from theaffected area can be accomplished by applying the cold plasma technologyin a practical large area applicator such as the plasma scrub brush. TheDevice frees the isotopes from the contaminated surface for subsequentremoval. For example, a radioactive compound can be broken down into itsconstituent components, including water. The isotope can then be removedfrom the substrate with the Device and disposed of readily with theother components.

Plasma “preprocessing” is employed in various industries to removecontaminants from surfaces. At higher powers, the plasma preprocessingcan also roughen surfaces on a micro scale and in the case of polymers,create dangling bonds. These processes are used to enhance subsequentsurface procedures such as coatings, adhesion and the like but typicallyrequire the use of a vacuum chamber in the prior art to apply a plasmaat sub-atmospheric pressures. This is particularly problematic withlarge or oddly shaped/non symmetrical objects or surfaces. The Devicecan be employed to preprocess or treat objects of any arbitrary size orshape in a safe environment. Preprocessing with the Device can alsopermit rapid assessment of effectiveness of any preprocessing procedure,and allow subsequent processes to proceed as may be necessary withoutbreaking a vacuum seal, if a vacuum used. For example, preprocessing ofsurfaces for hip or knee implant replacements can improve boneadhesion(s). Preprocessing can also, for example, promote adhesion ofnon-stick materials to other substrates or assist adhesion of markingsto surfaces where the necessary markings would otherwise wipe off.

The Device may be formed in any convenient physical size depending on anintended use. Medical use Devices may be small hand-held tools or largerwall-mounted tools on swing arms or tracks to be positioned as necessaryduring a medical procedure. Medical Devices may be formed as single-usearticles or multiple use with re-sterilization. Larger Devices may beformed in the sizes of household or industrial vacuums, or in anyconvenient size that may fulfill a particular or general use need. TheDevice may use any convenient power source, which may generally bedetermined by the intended use at the time of manufacture. For example,a Device intended for reuse or multiple uses that might be employed, forexample, in a hospital setting may run via an electrical cord.Alternatively, a Device that is manufactured for a one time use may berun on a battery, or, perhaps, a solar charge battery for larger areas.

The Device 100 can include a gas storage tank, or holding location, andtypically the gas would be a noble or inert gas, such as helium orargon. The gas storage tank can be operatively connected to a conduit102 to provide a source of gas to be fed into the Device. The conduit102, in turn, leads to the electrodes 104. The electrodes 104, whenactivated, at least partially ionize the gas to create the plasma streamor streams 106. The number of plasma streams 106 will be dependent onthe size of the Device 100 itself, and the size of the Device applicatorwhich may be formed as large as approximately a square meter or more.

Power input 108 into the Device 100 can run through a power distributionelectrode 110 into a bulk distributed resistor 112, as described below,or individual ballast resistors depending on the size of the applicator.A plasma beam 106 can be formed by passing the gas over a sharpconductive point, generally of an electrical flow wire, which is held ata relatively high voltage, generally greater than 1 KV, and at arelatively high frequency, generally in the range of approximately 10KHz to approximately 10 GHz. Alternatively, a sintered metal componentmay be employed to provide a sharp conductor necessary to create thestrong electric field gradient which helps pull electrons off the inertgas molecules and ionize them. The metal particle edges of a sinteredmetal component can act as sharp conductive points. Ballast resistorsmay be employed to prevent plasma beams from simultaneously functioningor firing, as depicted in FIG. 1. The plasma beam may exhibit negativeresistance and can prevent additional beams from functioning or firing.The associated resistance values can range from approximately 1 KΩ toapproximately 10 MΩ.

Individual resistors, at least one resistor or a plurality of resistors,may be used in cases where the number of resistors necessary or requiredto function with the area of a particular applicator would not becomeunwieldy. However, individual resistors can be problematic where largenumbers of resistors may be involved as in large area applicators.Rather than employ several hundreds or thousands of resistors for usewith one applicator, a combined bulk distributed resistor can be used asa resistor network.

The bulk distributed resistor can be formed of a slow cure epoxy thatcan be blended with at least one conductive component to produce adesired level of equivalent resistance. Alternatively, the bulkdistributed resistor may be formed of other materials, such as, forexample, room-temperature vulcanizing (“RTV”) rubber, silicones,polymers, and other materials and combinations that can combine withconductive components and that can be hardened or harden sufficientlyfor use. The conductive component can be formed of carbon nanotubes,carbon fibers, graphite powers, conductive metal particles, conductivemetal oxides, conductive polymers, or a combination thereof. Theconductive component may form a percentage of the resistor material inthe range of approximately 0.1% or less to approximately 80% or somewhat higher. In another embodiment, the amount of conductive materialsformed in the resistor may be in the range of approximately 25% toapproximately 60%. In yet another embodiment, the amount of conductivematerials formed in the resistor may be in the range of approximately35% to approximately 45%. The epoxy is poured into an appropriate mold,depending, inter alia, on the desired size, shape and flexibility for aparticular form of the Device. The epoxy may then be subjected to vacuumdegassing to remove most, if not all, of any air bubbles that may haveformed during the molding process.

The bulk distributed resistor can be formed in a pin grid array. A pingrid array can be inserted into the epoxy to an approximate depth of notmore than half the depth of the mold and rigidly held in the desiredposition until the epoxy has cured. Once the epoxy has cured, thehardened epoxy is removed from the mold and the pin array, leavingindividual channels for emitting a plasma beam through the applicator.The equivalent resistance of the bulk distributed resistor can havevalues of approximately 1 KΩ to approximately 10 MΩ between any pin anda common distribution electrode.

A common distribution electrode 110 can be attached to the epoxy surfacenear the power input source 108. The electrode 110 may be formed ofconductive paints, an additional epoxy layer of higher conductivity, ametal plate or some combination thereof. A plurality of channels may beformed through the bulk resistor to allow electrical flow, or other typeof power, to contact the gas as the gas flows through a gas manifold 103having an input 102 that is connected, directly or indirectly, to thegas storage tank. The electrical flow can ionize the gas as the powerpasses into the gas manifold 103 and forms a plasma stream 106 at thepoint of the electrical flow wire 104. The plasma stream 106 may thenflow through an emitter or output channel 114 that is operatively formedon the gas manifold 103 approximately opposite the bulk resistor 112. Amyriad number of plasma beam emitters 114 may be formed. The emitters114 can transect the Device applicator to allow the plasma beams 106 tocontact a surface outside the Device 100. Decontamination of a surfacein contact with the Device's plasma beam 106 then occurs rapidly, withseconds or minutes. Decontamination time frames may vary based on anumber of factors, including the type of surface, the type ofcontamination, additional biological and/or chemical compounds present,and temperature.

Alternatively, an intermediate electronegative gas conduit mayoptionally be disposed in a coaxial relationship relative to the gasconduit. A second gas conduit can be used to supply an electronegativegas, or air such as oxygen and nitrogen to maintain the plasma stream.Optionally, an outer aspiration conduit may also be coupled to anegative pressure source, such as a vacuum, that can be disposed insurrounding coaxial relationship, and also recessed, relative to theelectronegative gas conduit. An aspiration conduit can optionally beused to remove fluid and solid debris from the decontamination area, ifdesired.

Generally, oxygen and nitrogen in the atmosphere surrounding a plasmabeam can tend to confine the plasma discharge to an elongated narrowbeam. However, if plasma is applied to an enclosed or internal cavity,the gas flow from the plasma stream displaces any air remaining withinthe cavity. In order to maintain the profile of the plasma stream withina confined space, the intermediate electronegative gas conduit can beemployed. This intermediate electronegative gas conduit extends beyondthe inner gas conduit in order to maintain a laminar coaxial flow. Gasand air flow rates are generally equal. However, air flow rates inexcess of the gas flow rate can be used to enhance flow-assisted removalof smoke and debris generated during use of the Device, if desired.Excessive flow rates of either the gas or air can induce turbulence inthe plasma stream and distort the discharge jet shape.

Cross-boundary diffusion from the plasma stream into the surrounding airand air diffusion into the plasma stream can limit the effective lengthof the plasma stream. Inert gas can be substituted in place ofadditional gas flow in the intermediate electronegative gas conduit,which can significantly extend the plasma stream, if desired for aspecific environment. A reduced concentration gradient of the gas canoccur from an ionized jet diffusing into non-ionized gas and vice versa.This reduced concentration gradient can result in an overall plasmastream that can be approximately two and two and one-half times as longas plasma streams without a coaxial gas flow.

It will be appreciated that the disclosed Device addresses the pressingproblem of decontaminating an area without further risk to life orexposure. A contaminated area can be secured and sterilized ordecontaminated without direct human contact in a large number ofsettings that would prove unsafe or even dangerous for humans in shortterm of prolonged contact with the contaminants. The Device is alsoideal for decontamination of interior surfaces and areas, such asholding tanks, because the Device can be formed using a flexibleapplicator to adapt to specific environments and uses, and avoid humanexposure to high contamination levels enclosed within a tank.

In addition, the disclosed cold plasma Device has many uses in differentfields and applications, such as, inter alia, control of air flow over avariety of airfoil surfaces, including missiles, airplane wings,airplane rudders and the like. Use of the Devise for plasma actuationmay provide rapid control of the air flow for enhanced control of thedirection and maneuverability. Such uses include those disclosed in U.S.Pat. Nos. 7,070,144, and 7,275,013; and U.S. Patent Applications2006/0005545, and 2007/0089795, each of which is incorporated herein inits entirety. For example, US Patent Application 2007/0089795 disclosesa fluid actuator, or a plurality of actuators, having two conductors, ora plurality of conductors, on a dielectric. The application of voltageto a conductor may form a plasma flow which can be modified andcontrolled in a desired direction.

Also disclosed are microwave absorbing characteristics of dischargeplasmas which may form a “plasma shield” at higher intensities. Such aplasma shield would prove an effective defense against beamed-microwavedirected energy weapons. Moreover, where a plasma absorbed such directedenergy, the plasma's degree of ionization will increase, to become moreeffective and self-reinforcing. Such disclosures include U.S. Pat. Nos.4,897,285 and 6,492,951, which are incorporated herein in theirentirety.

The Device, and its bulk resistor system, may be employed with any ofthe incorporated disclosures, above. The Device may provide highlyefficient applications of plasma having greater plasma output over agreater surface area, according to the desired use.

It should be understood that the foregoing description is onlyillustrative of the invention. Various alternatives and modificationscan be devised by those skilled in the art without departing from theinvention. Accordingly, the present invention is intended to embrace allsuch alternatives, modifications and variances which fall within thescope of the appended claims.

1-20. (canceled)
 21. A sterilization device comprising: an applicatorhaving an input coupled to a gas source, the applicator having a firstsurface and a second surface opposite the first surface, the firstsurface configured to be placed adjacent to a surface of tissue to besterilized; at least one output channel, the at least one output channelhaving an individual wire electrode with a sharp conductive pointdisposed therein; and at least one resistor coupled to the individualwire electrode, the at least one resistor further coupled to a powersource for supplying the same electrical potential to the individualwire electrode, wherein the individual wire electrode is coupled to theat least one resistor such that the individual wire electrode extendsfrom the at least one resistor into the at least one output channel;wherein when the individual wire electrode is are powered by the powersource with the same electrical potential and gas is flowing through theat least one output channel, the sharp conductive point of theindividual wire electrode creates an electric field gradient whichremoves electrons from molecules of the gas and ionizes the gas to forma cold plasma beam at the at least one output channel under atmosphericpressure so as to sterilize the tissue in contact with the cold plasmabeam.
 22. The sterilization device of claim 21, wherein the gas isinert.
 23. The sterilization device of claim 22, wherein the inert gasis argon.
 24. The sterilization device of claim 22, wherein the inertgas is helium.
 25. The sterilization device of claim 21, wherein theapplicator is disposable.
 26. The sterilization device of claim 21,wherein the applicator is reusable.
 27. The sterilization device ofclaim 21, wherein the applicator is mounted on a swing arm configured tobe positioned as necessary for a procedure.
 28. The sterilization deviceof claim 27, wherein the applicator is configured to be operatedremotely.
 29. The sterilization device of claim 27, wherein theapplicator is configured to be preset for operation.
 30. Thesterilization device of claim 21, wherein at least one individualresistor forms a resistor network.
 31. The sterilization device of claim21, wherein the resistor network is at least one bulk distributedresistor, the at least one bulk distributed resistor being formed of aninsulating material that blended with at least one conductive componentto produce a desired level of equivalent resistance throughout the atleast one bulk distributed resistor.
 32. The sterilization device ofclaim 31, wherein the at least one bulk distributed resistor is formedwith a pin array.
 33. The sterilization device of claim 31, wherein theat least one conductive component is selected from the group consistingessentially of carbon nanotubes, carbon fibers, graphite powers,conductive metal particles, conductive metal oxides, conductive polymersand combinations thereof.
 34. The sterilization device of claim 31,wherein the power source directs power through the at least one bulkdistributed resistor.
 35. The sterilization device of claim 21, whereinthe applicator is a hand-held, flexible device configured to adjust tocontoured surfaces.
 36. The sterilization device of claim 21, whereinthe applicator is a wall-mounted, flexible device configured to adjustto contoured surfaces.